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strategy, and finally complete the batch production introduction and verification of new chips.   Requirements: Education/Experience Master degree or above in microelectronics, power electronics, electrical engineering, mechanical

; Requirements: Education/Experience Bachelor degree or above in microelectronics, materials engineering, power electronics, mechanical electronics or other related majors; More than 8 years of experience in power semiconductor packaging

degree or above, major in microelectronics, materials engineering, power electronics, mechanical electronics or other related fields; More than 8 years of experience in power semiconductor packaging product development or technology research and

Hervorragende Betreuung (Patenprogramm) Hohes Lernpotenzial durch direkte Integration in das Team Spannende Themen für Abschlussarbeiten Spaß an der Arbeit Faire Vergütung Your workplace Dresden oder München Your contact person Romy Heider

accelerate power module design and process development.   Requirements: Education/Experience Bachelor degree or above, majoring in Material science, Microelectronics, Mechanical engineering, Electrical engineering, Power electronics or

packaging processes to HQ; Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.   Requirements: Education/Experience Bachelor degree