degree or above, major in microelectronics, materials engineering, power electronics, mechanical electronics or other related fields; More than 8 years of experience in power semiconductor packaging product development or technology research and ... development; Experience in industry-leading product development and mass production is preferred; Proficient in packaging system design, thermal design, electrical design and reliability design, with industry-leading professional ability in one

or above, major in microelectronics, materials engineering, power electronics, mechanical electronics or other related fields; 1-3 years of experience in power semiconductor packaging product development or technology R&D is a must; Hand-on ... Bonder, Ultrasonic Welding, Molding equipment, etc.. Skills and Competencies Proactive, with pioneering spirit and a good sense of internal and external client; Passionate about engineering, with a strong spirit of innovation; Good command

; Requirements: Education/Experience Bachelor degree or above in microelectronics, materials engineering, power electronics, mechanical electronics or other related majors; More than 8 years of experience in power semiconductor packaging ... microstructure, basic working principles, common failure modes and power electronic circuits of power semiconductor devices such as Si, SiC and GaN; Profound knowledge of packaging system design, thermal design, electrical design and reliability design

Service ist für Sie nicht nur ein Schlagwort, sondern ein Versprechen? Sie möchten als gleichberechtigter Partner wahrgenommen werden, welcher an unserem...

Service ist für Sie nicht nur ein Schlagwort, sondern ein Versprechen? Sie möchten als gleichberechtigter Partner wahrgenommen werden, welcher an unserem...

accelerate power module design and process development.   Requirements: Education/Experience Bachelor degree or above, majoring in Material science, Microelectronics, Mechanical engineering, Electrical engineering, Power electronics or ... model, optimizing power module electrical design, chip selection, and solving difficult problems such as oscillation, current sharing, crosstalk, and circulation current; Responsible for the thermal resistance simulation, flow resistance

strategy, and finally complete the batch production introduction and verification of new chips.   Requirements: Education/Experience Master degree or above in microelectronics, power electronics, electrical engineering, mechanical ... business model innovations, we provide safer, more comfortable, and more convenient products and services.   Duties and responsibilities: Track industry technology trends, define electrical design technology roadmaps for SiC power